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Frost & Sullivan Honours Cambridge Nanotherm for its Chip on Heat Sink Technology for Thermal Management

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Frost & Sullivan Honours CambridgeFrost & Sullivan Honours Cambridge Nanotherm for its Chip on Heat Sink Technology for Thermal Management PR Newswire LONDON, Dec. 19, 2013 -- Cambridge Nanotherm's core technology aims at converting aluminium into aluminium oxide to produce a dielectric with high levels of thermal conductivity and dielectric strength. Based on its recent research on the thermal management solutions for the LED lighting market, Frost & Sullivan presents Cambridge Nanotherm with the 2013 European Frost & Sullivan Award for Technology Innovation. Trends in the light emitting diode (LED) market point to a shift from costly ceramic–based substrates to basic aluminium-based substrates for better thermal management. This focus on thermal management solutions has highlighted the role played by heat sinks, and their shortcomings. In this environment, Cambridge Nanotherm has risen to prominence with its novel Chip on Heat Sink (CoHS) technology, which not only dissipates heat more efficiently, but also reduces the footprint of the heat sink. Click here for the full multimedia experience of this release - http://bit.ly/1bUd8NQ Cambridge Nanotherm's CoHS technology employs the company's innovative and patented electrochemical process to generate the nano- ceramic dielectric layer of Aluminium oxide.

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Published 19 December 2013
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Language English
Frost & Sullivan Honours Cambridge Nanotherm for its Chip on Heat Sink Technology for Thermal Management

PR Newswire

-- Cambridge Nanotherm's core technology aims at converting aluminium into aluminium oxide to produce a dielectric with high levels of thermal conductivity and dielectric strength.