Lifetime prediction for solder die-attach in power applications by means of primary and secondary creep [Elektronische Ressource] / vorgelegt von Sylvain Déplanque
112 Pages
English
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Lifetime prediction for solder die-attach in power applications by means of primary and secondary creep [Elektronische Ressource] / vorgelegt von Sylvain Déplanque

Downloading requires you to have access to the YouScribe library
Learn all about the services we offer
112 Pages
English

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Lifetime prediction for solder die-attachin power applications by meansof primary and secondary creepVon der Fakult˜at fur˜ Maschinenbau, Elektrotechnik undWirtschaftsingenieurwesen der BrandenburgischenTechnischen Universit˜at Cottbuszur Erlangung des akademischen Grades eines Doktor-Ingenieursgenehmigte Dissertationvorgelegt vonDipl.-Ing.Sylvain D¶eplanquegeboren am 01.06.1979 in Lille (Frankreich)Vorsitzender: Professor Dr.-Ing. habil. V. MichailovGutachter: Dr.-Ing B. ViehwegerGutachter: Professor Dr.rer.nat.habil. B. MichelTag der Mundlic˜ hen Prufung:˜ 04. Dezember 2007iSummaryThe objective of this thesis was to accurately check and improve the models existing foreutectic solder alloys used in simulation tools. Creep deformation,which is the most im-portant deformation mode of solders, of two solder alloys, the widely used eutectic SnPbandtheenvironmentallyfriendlyalternativesolderalloySnAgCuwastested. Itwasshownthat it is necessary to model two difierent stages of this high temperature induced mech-anism: To improve the current material deflnition, primary creep must be implementedin the FE-software in addition to the existing secondary creep models. This thesis showshow it is possible to test creep behaviour under cyclic loading conditions with a test spec-imen of novel design. So, primary creep was observed and reoccurs cyclically under suchtest conditions. Furthermore, steady state creep is also always observed.

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Published 01 January 2007
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Language English
Document size 8 MB

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